Schlenk-Product:
CIC-Composite foil plain or with Cu/Zn-treatment
(CIC) Copper/Invar/Copper-composite material. Invar-foil, with copper-plating and Cu/Zn-Treatment on both sides. CIC is used for special printed circuit boards with ground and power planes and/or metal cores. The low CTE is crucial for aviational and special applications.
Standard specification:
Composition of material:
Copper layer: Oxygenfree copper, SE-Cu acc. to EN 1652 99.95 % Cu incl. Ag ; approx. 0.003 % P
Core layer: FeNi36; Nickel / Iron Alloy (Invar); 36.5 % Ni; 63.07 % Fe; 0.004 % C; 0.01 % Si; 0.002 % P; 0.0009 % S
Layer ratio: standard: 12.5 / 75 / 12.5 in volume percentage; others on request
Material designation: IPC-CF-152/2 CIC W X X
Details: please see our technical data sheet CIC
Strip thickness: 0.035 mm - 0.300 mm (0.0014" 0.021") standard: 0.150 mm (.006") Width: 10 mm - 610 mm (0.4" - 24.0")
Format: available in coil or cut to sheets, not levelled
Coil sizes:
ID: 150 mm (6") plastic core
Other cores-ID on request
Advantages of Schlenk‘s CIC-composite foil:
- uniform low profile treatment guarantees short etching times - very low coefficient of thermal expansion (CTE) in x-, y- and z-axis - complete production process based on inhouse know-how - standard thickness available from stock
Lot sizes:
We supply small lots for R&D, quickly and with the utmost flexibility as well as large lots up to complete container loads.
>> PDF (mm) >> PDF (inch)
all information contained herein is believed to be reliable, but the accuracy and completeness thereof are not guaranteed. The user shall determine the suitability of the product for the intended application.
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