Click here for Chinese Version (PDF)

amongst others our products are used for following applications: -  Batteries -  Beaten Metal / Metal Leaf -  Silver for decorative products -  Cable-Shielding -  EMI-Shielding -  Flexible Printed Circuits (FPC) -  FFC / FFCL -  Heating foils -  Lamination -  Plate Heat Exchangers -  Special Printed Circuits -  Solar -  Transformers -  Fuses

Download Adobe-Reader

Schlenk-Product:

ETP-copper foil

plain or  tin-clad




Lamination with polyester foil, paper or other backing materials. Also used to apply self-adhesive backing. Supplied in widest possible width. After lamination slit to narrower widths or die-cut. Lamination is handled our customers.


Standard specification:

Base-material:
ETP-Copper foil E-Cu 58 (BS: 101 ; CDA 110)

Additional surface upgrade (if requested):
-  Tin-cladding

Strip thickness:          0.010 - 0.200 mm (.0004" - .0079")   
             
Width:                       1 mm - 650 mm (.04" - 25.6")
                                  (depending on strip thickness)

Format:                      available in coil or cut to sheets, not levelled

Coil sizes:

ID: 150 mm (6") plastic core

ID: 76 mm (3") steel core

Other cores-ID on request






Advantages of Schlenk‘s foil:

-  high purity coppers
-  special surface suitable for lamination
-  In just about every lamination process Schlenk's metal foil can be used
   directly without any additional surface pre-treatment, regardless of the
   adhesive system used.
-  high electrical conductivity guarantees high shielding effectiveness


Lot sizes:

We supply small lots for R&D, quickly and with the utmost flexibility as well as large lots up to complete container loads.


>> PDF (mm)                >> PDF (inch)


all information contained herein is believed to be reliable, but the accuracy and completeness thereof are not guaranteed. The user shall determine the suitability of the product for the intended application.