Schlenk-Product:
RA-copper foil with Cu-Treatment
RA-Copper foil with Cu-Treatment and Cu/Zn-Treatment on one side or on both sides. Cu-Treatment acc. to IPC-4562. Used for production of base material laminates for Flexible Printed Circuits.
Standard specification:
Base-material ETP-Copper foil E-Cu 58 (BS: 101 ; CDA 110) or OF-copper foil OF-Cu (BS: C110, CDA 101) or OF-copper foil SE-Cu58 (BS: C103 ; CDA 103)
Treatment: dendritic copper-treatment or copper/zinc-treatment single side or double side
Grades: W5 (as rolled - wrought) IPC-4562/5 CU-W5 W7 (annealed - wrought) IPC-4562/7 CU-W7 W8 (low temperature annealable LTA) IPC-4562/8 CU-W8 other grades available on request
Strip thickness: 0.010 - 0.400 mm (0.0004" - 0.016") Width: 1 mm - 640 mm (0.04" - 25.2") (depending on strip thickness)
Format: available in coil or cut to sheets, not levelled
Coil sizes:
ID: 150 mm (6") plastic core
ID: 76 mm (3") steel core
Other cores-ID on request
Advantages of Schlenk‘s treated foil:
- uniform low profile treatment guarantees short etching times - foils is made from special selected high purity copper - thinnest available treated copper foil without carrier = 0.010 mm - heavier gauges up to 0.400mm with Cu-Treatment for heat sinks / ground plates - standard thicknesses available from stock
Lot sizes:
We supply small lots for R&D, quickly and with the utmost flexibility as well as large lots up to complete container loads.
>> PDF (mm) >> PDF (inch)
all information contained herein is believed to be reliable, but the accuracy and completeness thereof are not guaranteed. The user shall determine the suitability of the product for the intended application. |