(copper-invar-copper)

CIC is a copper-invar-copper composite material. It is an Invar foil with copper plating and/or Cu/Zn-Treatment on both sides. CIC composite material is mainly used for special printed circuit boards with ground and power planes and/or metal cores. The low CTE is crucial for aviation and special applications.


Standard specification

Composition of material:

Copper layer:           Oxygenfree copper, SE-Cu acc. to EN 1652
                               99.95 % Cu incl. Ag ; approx. 0.003 % P

Core layer:               FeNi36; Nickel / Iron Alloy (Invar);
                               36.5 % Ni; 63.07 % Fe; 0.004 % C; 0.01 % Si;
                               0.002 % P; 0.0009 % S

Layer ratio:               standard: 12.5 / 75 / 12.5 in volume percentage;
                               others on request

Treatment:               single sided or double-sided Cu-Treatment or
                               Cu/Zn-Treatment

Material designation: IPC-CF-152/2 CIC W X X

Details:                    please see our technical data sheet CIC

Strip thickness:        0.035 mm  -  0.300 mm (0.0014" - 0.012")
standard:                   0.150 mm (0.006")

Width:                     10 mm  -  610 mm (0.4" - 24.0")


Cu-Treated foil is produced in coil.
Most dimensions are also available as sheet, cut to length, not levelled.
Narrow slit dimensions, mainly in widths below 8 mm (0.32") are available in pancake coils or on traverse wound spools.


Lot sizes

We supply small lots for R&D, quickly and with the utmost flexibility, as well as large lots up to complete container loads.


Advantages of Schlenk‘s CIC-composite foils:

-   equal low profile treatment guarantees short etching times

-   very low coefficient of thermal expansion (CTE) in x-, y- and z-axis

-   complete production process based on in house know-how

-   standard thickness available from stock 

-   good EMI/RF shielding


Applications

Special Printed Circuits; core ground and power planes; Heat sinks