A special side of our production program is Cu-treated copper foils for (FPC) Flexible Printed Circuits.

We use our considerable experience in the production of RA copper.
We manufacture RA copper foil with Cu-Treatment and Cu/Zn-Treatment on one side or on both sides.
Cu-Treatment acc. to spec. IPC-4562 (supersedes IPC-MF-150F).


Standard specification

Base-material:
ETP-Copper foil E-Cu58 (BS: C101) or
OF-copper foil SE-Cu58 (BS: C103) or
OF-copper foil OF-Cu (BS: C110)

Treatment:   dendritic copper-treatment or copper/zinc-treatment      
                  single side or double side

Grades:       W5 (as rolled - wrought)                      IPC-4562/5    CU-W5
                  W7 (annealed - wrought)                      IPC-4562/7    CU-W7
                  W8 (low temperature annealable LTA)  IPC-4562/8    CU-W8
                  Other grades available on request

Thickness range                 width range

0.010 mm - 0.400 mm         1 mm - 640 mm
0.0004" - 0.016"                  0.04" - 25.2"
                                         (depending on strip thickness)

Cu-treated foil is produced in coil.
Most dimensions are also available as sheet, cut to length, not levelled.
Narrow slit dimensions, mainly in widths below 8 mm (0.32") are available in pancake coils or on traverse wound spools.


Lot sizes

We supply small lots for R&D, quickly and with the utmost flexibility, as well as large lots up to complete container loads.


Advantages of Schlenk‘s treated foils:

-  equal low profile treatment guarantees short etching times

-  foils made from specially selected high purity copper

-  thinnest available treated copper foil without carrier = 0.010 mm

-  heavier gauges up to 0.400mm with Cu-Treatment for heat sinks /
   ground plates

-  standard thicknesses and qualities are available from stock


Applications

Lamination; base material for Flexible Printed Circuits (FPC); batteries