Additive Manufacturing

Copper & Copper alloy Powders

Thermal and electrical conductivity as well as tribological properties of copper metals are very important for many different applications of automotive, aerospace, energy & power plants, industry, medical technology and consumer goods. Different youngest developments in Additive Manufacturing e.g. by using green laser power meanwhile enable the effectively processing of Copper & Copper alloy powders for future demands.

Typical AM products include contact materials, thermal management components, arts and consumer goods.

The spherical grain shape of atomized metal powders is an important characteristic for their optimal processability in additive manufacturing.

Possible AM processes are all techniques of Powder Bed Fusion (Laser Beam, Electron Beam, Binder Jetting) as well as the three dimensional free techniques of Powder Laser Deposition, Coldspray and Friction Welding.

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Rogal Bronze GK for Additive Manufacturing

SCHLENK offers special products of its portfolio of Rogal Bronze GK for a wide range of modern era applications of additive manufacturing.

Apparent density [g/cm³] flowability (sec/50g) Particle size [µm] sieve residue [µm/%] tap density [g/cm³] Tin content [%] Application
Rogal Bronze GK 0/25 ~4 not flowable d10 ~6, d50 ~13, d90 ~21 >25/max. 5 ~5 ~10
Rogal Bronze GK 10/45 VP/50468 ~5 not flowable d10 ~16, d50 ~28, d90 ~43 >45/max. 5 ~5.1 ~10
Rogal Bronze GK 0/63-03 ~5 ~12 d10 ~20, d50 ~41, d90 ~62 >63/max. 5 ~5.3 ~4
Rogal Bronze GK 0/63-06 ~5 ~12 d10 ~20, d50 ~41, d90 ~62 >63/max. 5 ~5.3 ~6
Rogal Bronze GK 0/80 ~5 ~13 d10 ~26, d50 ~52, d90 ~79 >80/max. 5 ~5.3 ~10
Rogal Bronze GK 32/125 ~5.2 ~12 d10 ~45, d50 ~79, d90 ~121 >125/max. 5, <32/max. 5 ~5.5 ~10

Rogal Copper GK for Additive Manufacturing

SCHLENK offers special products of its portfolio of Rogal Copper GK for a wide range of modern era applications of additive manufacturing.

Apparent density [g/cm³] flowability (sec/50g) Particle size [µm] sieve residue [µm/%] tap density [g/cm³] Application
Rogal Kupfer GK 0/10 VP/50347 ~3 not flowable d10 ~4, d50 ~8, d90 ~15 >25/max. 1 ~5
Rogal Kupfer GK 10/25 VP/50522 ~4.1 not flowable d10 ~13, d50 ~20, d90 ~27 >25/max. 5 ~5
Rogal Kupfer GK 0/25 ~4.4 not flowable d10 ~8, d50 ~16, d90 ~25 >25/max. 5 ~5.5
Rogal Kupfer GK 10/50 VP/50487 ~4.6 ~11 d10 ~21, d50 ~36, d90 ~52 >50/max. 5 ~5
Rogal Kupfer GK 0/50 ~4.6 ~12 d10 ~16, d50 ~32, d90 ~53 >50/max. 5 ~5.3
Rogal Kupfer GK 0/63 ~4.7 ~12 d10 ~19, d50 ~39, d90 ~63 >63/max. 5 ~5.4
Rogal Kupfer GK 0/80 ~5 ~12 d10 ~20, d50 ~46, d90 ~78 >80/max. 5 ~5.4
Rogal Kupfer GK 45/100 ~5 ~13 d10 ~57, d50 ~79, d90 ~105 >100/max. 5, <45/max. 10 ~5.3
Rogal Kupfer GK 0/160 ~4.8 ~15 d10 ~45, d50 ~84, d90 ~135 >160/max. 5 ~5

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