Rogal Copper GK for Additive Manufacturing

SCHLENK offers special products of its portfolio of Rogal Copper GK for a wide range of modern era applications of additive manufacturing.

Rogal Copper GK for Additive Manufacturing

Applications:
Lithography-based Metal Manufacturing (LMM) Lithography-based Metal Manufacturing (LMM)
Metal Binder Jetting (MBJ) Metal Binder Jetting (MBJ)
Coldspray Coldspray
Selective laser sintering (SLS) Selective laser sintering (SLS)
Direct Energy Deposition (DED) Direct Energy Deposition (DED)
Electron beam powder bed fusion (EBM) Electron beam powder bed fusion (EBM)
Selective Laser Melting (SLM), Laser based Powder Bed Fusion (LPBF) Selective Laser Melting (SLM), Laser based Powder Bed Fusion (LPBF)

Product NameD 10-value [µm]D 50 value [µm]D 90 value [µm]Apparent density [g/cm³]FluidityApplication
Rogal® Select CuCr1Zr S 0/203-1010-1815-25> 4.5not flowableLithography-based Metal Manufacturing (LMM)Metal Binder Jetting (MBJ)
Rogal® Select CuCr1Zr S 15/4515-2127-3344-504.6-5.5≤ 14ColdspraySelective laser sintering (SLS)
Rogal® Select CuCr1Zr S 20/6320-3035-4550-634.6-5.5≤ 14Lithography-based Metal Manufacturing (LMM)Metal Binder Jetting (MBJ)
Rogal® Select CuCr1Zr S 45/10540-5060-7880-1104.6-5.5≤ 17Direct Energy Deposition (DED)Electron beam powder bed fusion (EBM)
Rogal® Select CuCr1Zr S 63/16050-7580-110120-1554.6-5.5≤ 17Direct Energy Deposition (DED)
Rogal® Select Cu99,95 S 0/152-87-1512-20≥ 3.6not flowableColdsprayLithography-based Metal Manufacturing (LMM)Metal Binder Jetting (MBJ)
Rogal® Select CuAl10Ni5Fe4 0/203-1010-1815-25≥ 3.8not flowableLithography-based Metal Manufacturing (LMM)Metal Binder Jetting (MBJ)
Rogal® Select CuNi2SiCr S 0/203-1010-1815-25> 4.5not flowableLithography-based Metal Manufacturing (LMM)Metal Binder Jetting (MBJ)
Rogal® Select Cu99,95 S 0/203-1010-1815-25≥ 3.6not flowableColdsprayLithography-based Metal Manufacturing (LMM)Metal Binder Jetting (MBJ)
Rogal® Select Cu99,95 S 15/4510-2225-3535-484.6-5.5≤ 14ColdspraySelective Laser Melting (SLM), Laser based Powder Bed Fusion (LPBF)
Rogal® Select CuAl10Ni5Fe4 15/4515-2325-3535-503.8-4.8≤ 15ColdspraySelective Laser Melting (SLM), Laser based Powder Bed Fusion (LPBF)
Rogal® Select CuNi2SiCr S 15/4515-2127-3344-504.6-5.5≤ 14ColdspraySelective Laser Melting (SLM), Laser based Powder Bed Fusion (LPBF)
Rogal® Select Cu99,95 S 20/6318-3035-4650-664.6-5.5≤ 14ColdspraySelective Laser Melting (SLM), Laser based Powder Bed Fusion (LPBF)
Rogal® Select CuAl10Ni5Fe4 20/6318-3035-4650-633.8-4.8≤ 15ColdspraySelective Laser Melting (SLM), Laser based Powder Bed Fusion (LPBF)
Rogal® Select CuNi2SiCr S 20/6320-3035-4550-634.6-5.5≤ 14ColdspraySelective Laser Melting (SLM), Laser based Powder Bed Fusion (LPBF)
Rogal® Select Cu99,95 S 45/10540-5060-7880-1104.6-5.5≤ 16Direct Energy Deposition (DED)ColdsprayElectron beam powder bed fusion (EBM)
Rogal® Select CuAl10Ni5Fe4 45/10040-5060-7880-1103.8-4.8≤ 18Direct Energy Deposition (DED)Electron beam powder bed fusion (EBM)
Rogal® Select CuNi2SiCr S 45/10540-5060-7880-1104.6-5.5≤ 17Direct Energy Deposition (DED)Electron beam powder bed fusion (EBM)
Rogal® Select Cu99,95 S 63/16050-7580-110120-1554.6-5.5≤ 16Direct Energy Deposition (DED)Electron beam powder bed fusion (EBM)
Rogal® Select CuAl10Ni5Fe4 53/15045-6065-95120-1503.8-4.8≤ 18Direct Energy Deposition (DED)
Rogal® Select CuNi2SiCr S 63/16050-7580-110120-1554.6-5.5≤ 17Direct Energy Deposition (DED)