Rogal Copper GK for Additive Manufacturing
SCHLENK offers special products of its portfolio of Rogal Copper GK for a wide range of modern era applications of additive manufacturing.
Applications:
Coldspray
Lithography-based Metal Manufacturing (LMM)
Metal Binder Jetting (MBJ)
Selective Laser Melting (SLM), Laser based Powder Bed Fusion (LPBF)
Direct Energy Deposition (DED)
Electron beam powder bed fusion (EBM)| Product Name | D 10-value [µm] | D 50 value [µm] | D 90 value [µm] | Apparent density [g/cm³] | Fluidity | Application |
|---|---|---|---|---|---|---|
| Rogal® Select Cu99,95 S 0/20 | 3-10 | 10-18 | 15-25 | ≥ 3.6 | not flowable | |
| Rogal® Select Cu99,95 S 15/45 | 10-22 | 25-35 | 35-48 | 4.6-5.5 | ≤ 14 | |
| Rogal® Select Cu99,95 S 20/63 | 18-30 | 35-46 | 50-66 | 4.6-5.5 | ≤ 14 | |
| Rogal® Select Cu99,95 S 45/105 | 40-50 | 60-78 | 80-110 | 4.6-5.5 | ≤ 16 | |
| Rogal® Select Cu99,95 S 63/160 | 50-75 | 80-110 | 120-155 | 4.6-5.5 | ≤ 16 | |
