Rogal Copper GK for Additive Manufacturing
SCHLENK offers special products of its portfolio of Rogal Copper GK for a wide range of modern era applications of additive manufacturing.
Applications:
3D-Printing
Powder laser desposition (LMD)
Coldspray
Friction Welding
Selective laser sintering (SLS)
Laser Beam powder bed fusion (LB-PBF), Selective Laser Melting (SLM), Direct Metal Laser Sintering (DMLS)
Electron beam powder bed fusion (EBM)| Product Name | Particle size [µm] | Apparent density [g/cm³] | Fluidity | tap density [g/cm³] | sieve residue [µm/%] | Application |
|---|---|---|---|---|---|---|
| Rogal Kupfer GK 0/10 VP/50347 | d10 ~4, d50 ~8, d90 ~15 | approx. 3 g/cm³ | not flowable | ~5 | >25/max. 1 | |
| Rogal Kupfer GK 10/25 VP/50522 | d10 ~13, d50 ~20, d90 ~27 | approx. 4.1 | not flowable | ~5 | >25/max. 5 | |
| Rogal Kupfer GK 0/25 | d10 ~8, d50 ~16, d90 ~25 | approx. 4.4 | not flowable | ~5,5 | >25/max. 5 | |
| Rogal Kupfer GK 10/50 VP/50487 | d10 ~21, d50 ~36, d90 ~52 | approx. 4.6 | approx. 11 | ~5,5 | >25/max. 5 | |
| Rogal Kupfer GK 0/50 | d10 ~16, d50 ~32, d90 ~53 | approx. 4.6 | approx. 12 | ~5,3 | >50/max. 5 | |
| Rogal Kupfer GK 0/63 | d10 ~19, d50 ~39, d90 ~63 | approx. 4.7 | approx. 12 | ~5,4 | >63/max. 5 | |
| Rogal Kupfer GK 0/80 | d10 ~20, d50 ~46, d90 ~78 | approx. 5 g/cm³ | approx. 12 | ~5,4 | >80/max. 5 | |
| Rogal Kupfer GK 45/100 | d10 ~57, d50 ~79, d90 ~105 | approx. 5 g/cm³ | approx. 13 | ~5,3 | >100/max. 5, <45/max. 10 | |
| Rogal Kupfer GK 0/160 | d10 ~45, d50 ~84, d90 ~135 | approx. 4.8 | approx. 15 | ~5 | >160/max. 5 | |
