Power electronics - CuNex
![](/fileadmin/editorsCMS/Medien/02_Maerkte_und_Produkte/Power_electronics_-_CuNex/Cuprum_Bild_klein.jpg)
Copper sinter pastes for high power and optoelectronics packaging
Under the “Cuprum” series CuNex (a spin-off from Technical University Ingolstadt) and SCHLENK launched the world‘s first copper sinter paste designed and made in Germany. Cuprum is suitable for a wide range of applications ranging from laser diodes and high power LEDs in optoelectronics packaging, Si and SiC devices for high power electronics and specialized solutions for battery applications.
The product from CuNex is a combination of more than 5 years of extensive research in the field of copper based interconnect technologies, supported by SCHLENK with a rich history of 150 years in working with copper and copper alloys, offering world-class manufacturing facilities and a secure supply chain worldwide. The Cuprum series has class-leading features for die attach and large area bonding:
![Low cost Low cost](/fileadmin/editorsCMS/Medien/02_Maerkte_und_Produkte/Power_electronics_-_CuNex/Cunex_Logos/icons1.png)
Low cost → substantial cost advantage compared to commercial Ag sinter paste. Compatible with existing industrialized Ag sinter process and equipment.
![Low sintering temperature (≤ 275°) Low sintering temperature (≤ 275°)](/fileadmin/editorsCMS/Medien/02_Maerkte_und_Produkte/Power_electronics_-_CuNex/Cunex_Logos/icons2.png)
Low sintering temperature (≤ 275°) → reduced wear on substrates & components
![Rapid sintering process Rapid sintering process](/fileadmin/editorsCMS/Medien/02_Maerkte_und_Produkte/Power_electronics_-_CuNex/Cunex_Logos/icons3.png)
Rapid sintering process → fast pre-drying of just 5 min. and rapid sintering (3-5 min.) for all metallization (Ag, Au, Cu)
![Low bonding pressure (≤ 20 MPa) Low bonding pressure (≤ 20 MPa)](/fileadmin/editorsCMS/Medien/02_Maerkte_und_Produkte/Power_electronics_-_CuNex/Cunex_Logos/icons4.png)
Low bonding pressure (≤ 20 MPa) → reduced wear and damage of chips
![High thermal conductivity (> 220 W/mK) High thermal conductivity (> 220 W/mK)](/fileadmin/editorsCMS/Medien/02_Maerkte_und_Produkte/Power_electronics_-_CuNex/Cunex_Logos/icons5.png)
High thermal conductivity (> 220 W/mK) → optimal performance for die-attach and substrate attach applications
![Suitable for standard metallizations Suitable for standard metallizations](/fileadmin/editorsCMS/Medien/02_Maerkte_und_Produkte/Power_electronics_-_CuNex/Cunex_Logos/icons6.png)
Suitable for standard metallizations (e.g. Au, Ag, Cu, Pd) → flexibility
![Formulations enabling sintering in open bond chamber/nitrogen Formulations enabling sintering in open bond chamber/nitrogen](/fileadmin/editorsCMS/Medien/02_Maerkte_und_Produkte/Power_electronics_-_CuNex/Cunex_Logos/icons7.png)
Formulations enabling sintering in open bond chamber/nitrogen → flexibility & cost savings (equipment and process)
![Flexibility on die size for die-attach applications Flexibility on die size for die-attach applications](/fileadmin/editorsCMS/Medien/02_Maerkte_und_Produkte/Power_electronics_-_CuNex/Cunex_Logos/icons8.png)
Flexibility on die size for die-attach applications → 0.5 mm2 to 100 mm2
![Environmental friendly binders and metal particles Environmental friendly binders and metal particles](/fileadmin/editorsCMS/Medien/02_Maerkte_und_Produkte/Power_electronics_-_CuNex/Cunex_Logos/icons9.png)
Environmental friendly binders and metal particles. No nanoparticles
![Easy cleaning Easy cleaning](/fileadmin/editorsCMS/Medien/02_Maerkte_und_Produkte/Power_electronics_-_CuNex/Cunex_Logos/icons10.png)
Easy clean paste after stencil/screen printing. No residues after sintering
![Storage @ room temperature for 6 months Storage @ room temperature for 6 months](/fileadmin/editorsCMS/Medien/02_Maerkte_und_Produkte/Power_electronics_-_CuNex/Cunex_Logos/icons11.png)
Storage @ room temperature for 6 months
![no nanoparticles or harmful organics no nanoparticles or harmful organics](/fileadmin/editorsCMS/Medien/02_Maerkte_und_Produkte/Power_electronics_-_CuNex/Cunex_Logos/icons12.png)
no nanoparticles or harmful organics in the paste formulation. Reduced health hazard to operators
Together with the copper sinter paste CuNex and SCHLENK offer the full technology service to ensure a smooth implementation in any end-user application.
- Extensive in-house R&D
for material design & automotive certified production environment
- Specialized engineering solutions
product and process for customer specific applications
- Extensive application support
on-site, worldwide and remote
For more information please also visit the CuNex website. For any inquiries please reach out to info@cunex.de