Kupfersinterpaste, Kupferlegierungen, Leistungselektronik, CuNex

Power electronics - CuNex

Copper sinter pastes for high power and optoelectronics packaging

Under the “Cuprum” series CuNex (a spin-off from Technical University Ingolstadt) and SCHLENK launched the world‘s first copper sinter paste designed and made in Germany. Cuprum is suitable for a wide range of applications ranging from laser diodes and high power LEDs in optoelectronics packaging, Si and SiC devices for high power electronics and specialized solutions for battery applications.

The product from CuNex is a combination of more than 5 years of extensive research in the field of copper based interconnect technologies, supported by SCHLENK with a rich history of 150 years in working with copper and copper alloys, offering world-class manufacturing facilities and a secure supply chain worldwide. The Cuprum series has class-leading features for die attach and large area bonding:

Low cost

Low cost → substantial cost advantage compared to commercial Ag sinter paste. Compatible with existing industrialized Ag sinter process and equipment.

Low sintering temperature (≤ 275°)

Low sintering temperature (≤ 275°) → reduced wear on substrates & components

Rapid sintering process

Rapid sintering process → fast pre-drying of just 5 min. and rapid sintering (3-5 min.) for all metallization (Ag, Au, Cu)

Low bonding pressure (≤ 20 MPa)

Low bonding pressure (≤ 20 MPa) → reduced wear and damage of chips

High thermal conductivity (> 220 W/mK)

High thermal conductivity (> 220 W/mK) → optimal performance for die-attach and substrate attach applications

Suitable for standard metallizations

Suitable for standard metallizations (e.g. Au, Ag, Cu, Pd) → flexibility

Formulations enabling sintering in open bond chamber/nitrogen

Formulations enabling sintering in open bond chamber/nitrogen → flexibility & cost savings (equipment and process)

Flexibility on die size for die-attach applications

Flexibility on die size for die-attach applications → 0.5 mm2 to 100 mm2

Environmental friendly binders and metal particles

Environmental friendly binders and metal particles. No nanoparticles

Easy cleaning

Easy clean paste after stencil/screen printing. No residues after sintering

Storage @ room temperature for 6 months

Storage @ room temperature for 6 months

no nanoparticles or harmful organics

no nanoparticles or harmful organics in the paste formulation. Reduced health hazard to operators

Together with the copper sinter paste CuNex and SCHLENK offer the full technology service to ensure a smooth implementation in any end-user application.

  • Extensive in-house R&D

for material design & automotive certified production environment

  • Specialized engineering solutions

product and process for customer specific applications

  • Extensive application support

on-site, worldwide and remote
 

For more information please also visit the CuNex website. For any inquiries please reach out to info@cunex.de