Rogal® Copper GK

Rogal® Copper GK

Smelting and atomization are used to produce copper powders from highly pure refined or electrolytic copper.

In the air atomization process used by SCHLENK, spherical particles are formed , which are then classified into the required particle size distribution.

Applications:

Chemical technical applications
Contact materials
Technical plastics, compounds
Powder metallurgy, sintering materials
Friction and brake linings
Blasting abrasive techniques
Soldering and joining techniques
Product Name Apparent density [g/cm³] Fluidity Copper content [%] Phosphorus content [%] Sieve analysis [%] Application
Rogal® Kupfer GK 0/25 approx. 0.5 not flowable min. 99 % max. 0.4 % > 25µm: max.5
Chemical technical applications
Contact materials
Technical plastics, compounds
Powder metallurgy, sintering materials
Friction and brake linings
Blasting abrasive techniques
Soldering and joining techniques
Rogal® Kupfer GK 0/315 approx. 0.5 flowable min. 99 % max. 0.4 % >315µm: max. 5
Chemical technical applications
Contact materials
Technical plastics, compounds
Powder metallurgy, sintering materials
Friction and brake linings
Blasting abrasive techniques
Rogal® Kupfer GK 0/250 approx. 0.5 flowable min. 99 % max. 0.4 % >250µm: max. 5
Chemical technical applications
Contact materials
Technical plastics, compounds
Powder metallurgy, sintering materials
Friction and brake linings
Blasting abrasive techniques
Rogal® Kupfer GK 50/100 approx. 0.5 flowable min. 99 % max. 0.4 % >100µm :max.5 <50µm: max.10
Chemical technical applications
Contact materials
Technical plastics, compounds
Powder metallurgy, sintering materials
Friction and brake linings
Blasting abrasive techniques
Soldering and joining techniques
Rogal® Kupfer GK 0/63 approx. 0.5 flowable min. 99 % max. 0.4 % > 63 µm: max. 5
Chemical technical applications
Contact materials
Technical plastics, compounds
Powder metallurgy, sintering materials
Friction and brake linings
Blasting abrasive techniques
Soldering and joining techniques
Rogal® Kupfer GK 0/50 approx. 0.5 flowable min. 99 % max. 0.4 % > 50 µm: max. 5
Chemical technical applications
Contact materials
Technical plastics, compounds
Powder metallurgy, sintering materials
Friction and brake linings
Blasting abrasive techniques
Soldering and joining techniques

If you would like further information we would be happy to assist you.

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